Samsung Electronics Announces Availability of Its Next Generation 2.5D Integration Solution ‘I-Cube4’ for High-Performance Applications

'I-Cube4' incorporates four HBMs and one logic die on a paper-thin silicon interposer, supporting enhanced thermal management as well as stable power supply SEOUL, South Korea--(BUSINESS WIRE)--#5g--Samsung Electronics Co., Ltd., a world leader in adv...

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