Call for Papers
2015 International Conference on Planarization/CMP Technology (ICPT 2015)
September 30 – October 2, 2015
Wild Horse Pass Hotel & Casino
Chandler, AZ USA
ICPT 2015 provides the largest forum for academic researchers, industrial practitioners and engineers from around the world dedicated to the exchange of information on the state-of-the-art in Chemical Mechanical Polishing (CMP) and other planarization technologies. Abstracts of new work are requested and can include the following topics:
Transistor and interconnect CMP applications
3D ICs/TSV/packaging applications
CMP for emerging technologies such as MEMS/LEDs/power devices
Other planarization technologies such as lapping/grinding/etching
Process integration, process control & reliability
Consumables, equipment, and metrology
Defects and Post CMP cleaning
CMP fundamentals, modeling, and simulation
Environmental issues related to CMP
Important Dates:
Abstract Submission Deadline: April 16, 2015
Notification of Abstract Acceptance: June 1, 2015
Camera Ready Papers Due: July 31, 2015
Abstracts should be a minimum of 200 words, written in English, and may include figures. Abstracts will be scored according to the originality and significance of the work as well as the quality of the information and data included. Please indicate the preference of oral or poster presentation, and the targeted topic area when submitting the abstract. Full-length papers, including figures and references will be limited to 4-8 pages for oral presenters and 3-4 pages for poster presenters. The full text of conference oral and poster papers will be published as an IEEE proceedings volume.
Website links: (ctrl-click the underlined text or copy the URL into your browser) Conference website: http://www.icpt2015cmp.org Abstract template: http://www2.avs.org/conferences/ICPT2015/pdfs/Abstract_Template_ICPT2015.doc Exhibit/Sponsorship Opportunities:
http://www2.avs.org/conferences/ICPT2015/exhibitors_icpt.htm